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Screenshots

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Details

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Wafercadence Main Features

• No data egress
  All images and data stay on your network, keeping everything secure.
• Defect labeling
  Each defect is labeled by type, such as particle or scratch, to help engineers understand issues quickly.
• Fast engineer alerts
  Engineers receive quick alerts about problems before the next wafer batch starts.
• Early warning signals
  Detects problematic patterns early, often before many defects are visible.
• On-premise deployment
  It joins data like inspection files and test results inside your fab network, never leaving your system.
• Work on your hardware
  All tools run on your own equipment without needing external services or data transfer.
• Reduced diagnostic time
  It reduces hours needed for manual root-cause analysis.
• Real-time data processing
  It processes data immediately from inspection tools without delay.
• Six platform capabilities
  The SaaS has six tools that help move from inspection to fixing problems faster.
• Spatial pattern detection
  It finds patterns like edge-rings or arcs at very low defect counts, sometimes as few as 3 defects per lot.
• Inline defect classification
  Uses AI to label defects automatically with over 97% accuracy as soon as they are detected.
• Defect-to-root-cause in 12 minutes
  The system finds root causes of defects within 12 minutes after inspection.

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